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TK36
TK36
Phase Control Thyristor Advance Information
Replaces January 2000 version, DS4255-4.0 DS4255-5.0 July 2001
FEATURES
s High Surge Capability
KEY PARAMETERS VDRM IT(AV) ITSM dVdt* dI/dt 1200V 245A 5500A 200V/s 500A/s
APPLICATIONS
s High Power Drives s High Voltage Power Supplies s DC Motor Control s Welding s Battery Chargers
*Higher dV/dt selections available
VOLTAGE RATINGS
Type Number Repetitive Peak Voltages VDRM VRRM V 1200 1000 800 Conditions
TK36 12 M or K TK36 10 M or K TK36 08 M or K
Tvj = 0 to 125C, IDRM = IRRM = 100mA, VDRM, VRRM tp = 10ms, VDSM & VRSM = VDRM & VRRM + 100V respectively Outline type code: TO93. See Package Details for further information. Fig. 1 Package outline
Lower voltage grades available.
ORDERING INFORMATION
When ordering, select the required part number shown in the Voltage Ratings selection table, then:Add K to type number for 3/4" 16 UNF thread, e.g. TK36 12K. or Add M to type number for M16 thread, e.g. TK36 12M. Note: Please use the complete part number when ordering and quote this number in any future correspondance relating to your order.
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TK36
CURRENT RATINGS
Tcase = 60C unless stated otherwise. Symbol IT(AV) IT(RMS) IT Parameter Mean on-state current RMS value Continuous (direct) on-state current Conditions Half wave resistive load Max. 323 507 425 Units A A A
Tcase = 80C unless stated otherwise. Symbol IT(AV) IT(RMS) IT Parameter Mean on-state current RMS value Continuous (direct) on-state current Conditions Half wave resistive load Max. 245 385 315 Units A A A
SURGE RATINGS
Symbol ITSM I2t ITSM I2t Parameter Surge (non-repetitive) on-state current I2t for fusing Surge (non-repetitive) on-state current I2t for fusing Conditions 10ms half sine; Tcase = 125oC VR = 50% VRRM - 1/4 sine 10ms half sine; Tcase = 125oC VR = 0 Max. 4.4 96.8 x 103 5.5 151.25 x 103 Units kA A2s kA A2s
THERMAL AND MECHANICAL DATA
Symbol Rth(j-c) Rth(c-h) Parameter Thermal resistance - junction to case Thermal resistance - case to heatsink dc Mounting torque 35.0Nm with mounting compound On-state (conducting) Tvj Virtual junction temperature Reverse (blocking) Tstg Storage temperature range Mounting torque -40 30.0 125 150 35.0
o
Conditions
Min. -
Max. 0.13 0.06 125
Units
o
C/W C/W
o
o
C
C C
o
Nm
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TK36
DYNAMIC CHARACTERISTICS
Symbol VTM IRRM/IDRM dV/dt Parameter Maximum on-state voltage Peak reverse and off-state current Maximum linear rate of rise of off-state voltage Conditions At 600A peak, Tcase = 25oC At VRRM/VDRM, Tcase = 125oC To 60% VDRM Tj = 125oC, Gate open circuit Gate source 20V, 20 tr 0.5s, Tj = 125C At Tvj = 125oC At Tvj = 125oC VD = 300V, IG = 1A, IT = 50A, dI/dt = 50A/s, dIG/dt = 1A/s, Tj = 25oC Tj = 25oC, VD = 12V Tj = 25oC, VD = 12V, ITM = 1A Repetitive 50Hz Non-repetitive VT(TO) rT tgd IL IH Threshold voltage On-state slope resistance Delay time Latching current Holding current Min. Max. 1.3 25 200 500 800 0.88 0.7 1.5 50 Units V mA V/s A/s A/s V m s mA mA
dI/dt
Rate of rise of on-state current
GATE TRIGGER CHARACTERISTICS AND RATINGS
Symbol VGT IGT VGD VFGM VFGN VRGM IFGM PGM PG(AV) Parameter Gate trigger voltage Gate trigger current Gate non-trigger voltage Peak forward gate voltage Peak forward gate voltage Peak reverse gate voltage Peak forward gate current Peak gate power Mean gate power Anode positive with respect to cathode Conditions VDRM = 12V, Tcase = 25oC, RL = 6 VDRM = 12V, Tcase = 25oC, RL = 6 At VDRM Tcase = 125oC, RL = 1k Anode positive with respect to cathode Anode negative with respect to cathode Typ. Max. 3.0 200 0.2 30 0.25 5 4 16 3 Units V mA V V V V A W W
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TK36
CURVES
5000 Measured under pulse conditions Tj = 125C
SINUSOIDAL CURRENT WAVEFORM
4000
Instantaneous on-state current, IT - (A)
3000
2000
RECTANGULAR CURRENT WAVEFORM
1000
0 0
2.0 4.0 Instantaneous on-state voltage, VT - (V)
6.0
Fig.2 Maximum (limit) on-state characteristics
Fig.3 Maximum on-state power dissipation for sinusoidal current waveform 4/8
Fig.4 Maximum allowable case temperature for sinusoidal current waveform
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TK36
Fig.5 Maximum on-state power dissipation for rectangular current waveform
Fig.6 Maximum allowable case temperature for rectangular current waveform
Fig.7 Gate trigger characteristics
Fig.8 Transient thermal impedance - junction to case
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Fig.9 Multiplying factor for non-repetive sub-cycle surge onstate current and I2t rating
Fig.10 Multiplying factor for non-repetive surge on-state current
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PACKAGE DETAILS
For further package information, please contact your nearest Customer Service Centre. All dimensions in mm, unless stated otherwise. DO NOT SCALE.
O4
18 2 O9 0.5
8 min
35 max
230 10
230 10
M = M16 x 2A K = 3/4" 16 UNF
K = 27.0 0.5 M = 18.0 0.5
Nominal weight: 290g Mounting torque: 35Nm 10% Gate lead colour: White Cathode lead colour: Red Package outine type code: TO93
Hex. 32AF
12.3 min
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POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and current capability of our semiconductors. We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of our customers. Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete Solution (PACs).
DEVICE CLAMPS
Disc devices require the correct clamping force to ensure their safe operation. The PACS range includes a varied selection of pre-loaded clamps to suit all of our manufactured devices. Types available include cube clamps for single side cooling of `T' 23mm and `E' 30mm discs, and bar clamps right up to 83kN for our `Z' 100mm thyristors and diodes. Clamps are available for single or double side cooling, with high insulation versions for high voltage assemblies. Please refer to our application note on device clamping, AN4839
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on request. For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer service office.
http://www.dynexsemi.com e-mail: power_solutions@dynexsemi.com
HEADQUARTERS OPERATIONS DYNEX SEMICONDUCTOR LTD Doddington Road, Lincoln. Lincolnshire. LN6 3LF. United Kingdom. Tel: 00-44-(0)1522-500500 Fax: 00-44-(0)1522-500550 DYNEX POWER INC. 99 Bank Street, Suite 410, Ottawa, Ontario, Canada, K1P 6B9 Tel: 613.723.7035 Fax: 613.723.1518 Toll Free: 1.888.33.DYNEX (39639) CUSTOMER SERVICE CENTRES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 SALES OFFICES Mainland Europe Tel: +33 (0)1 58 04 91 00. Fax: +33 (0)1 46 38 51 33 North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) / Tel: (949) 733-3005. Fax: (949) 733-2986. UK, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020 These offices are supported by Representatives and Distributors in many countries world-wide. (c) Dynex Semiconductor 2001 Publication No. DS4255-5 Issue No. 5.0 July 2001 TECHNICAL DOCUMENTATION - NOT FOR RESALE. PRINTED IN UNITED KINGDOM
Datasheet Annotations: Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started. Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change. Advance Information: The product design is complete and final characterisation for volume production is well in hand. No Annotation: The product parameters are fixed and the product is available to datasheet specification.
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request. All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
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